Senior Multi-Physical System Engineer
il y a 3 semaines
European Tech Recruit is working closely with a multinational semiconductor company based in Grenoble, seeking a Board Level Multi-Physical System Engineer to join their team.
Key Responsibilities:- Explore new technologies such as electromagnetic, thermo-mechanical, and physicochemical field simulation modeling of complex modules, especially around their interfaces (such as BLT/TIM or underfill), with in-situ non-destructive technologies.
- Provide technical insights on next-generation technology trends and implement them in upcoming hardware products.
- Collaborate with the local and Chinese team to solve next challenges and participate in preparing specification and design documents.
- Have a deep understanding of microelectronics packaging, module substrate process, and module process, and be able to independently complete multi-physical field and multi-scale simulation and modeling of complex module packaging.
- Have multi-scale and multi-physical field simulation modeling capabilities in electricity, magnetism, heat transfer, and mechanical. Understand packaging challenges for reliability such as warpage and stress management, thermo-migration, electro-migration, and heat dissipation.
- Good knowledge in material properties of the constitutive layer such as PCB, TIM, substrate, underfill, and their implication on the overall integration.
- Good experience with industrial simulation software such as COMSOL or HFSS.
- Experience in Python coding is a plus.
- Ability to work in a group and individually is required. Ability to work in a diversified team and have good communication skills.
- Must be eligible to work in the European Union to be considered for this position.
- Fluent in English.
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