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Corbeil-Essonnes, Île-de-France Ligentec SA Temps plein{"h2": "Job Summary", "p": "At Ligentec SA, we are seeking a highly skilled Tape Out Engineer to join our team. As a key member of our engineering team, you will be responsible for ensuring the successful tape-out process of photonic integrated circuits (PICs) for our clients. This is a unique opportunity to bring your expertise in semiconductor...
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Customer Tape Out Engineer
Il y a 4 mois
LIGENTEC is a fast-growing European company with headquarter in Lausanne, Switzerland. Since 2021 we expanded our manufacturing capabilities by creating LIGENTEC France, in the South of Paris. We specialize in the design & manufacturing of Photonic Integrated Circuits (PICs) for customers in high-tech areas such as Quantum Technologies, LiDAR, Space Technologies, and Biosensors.
LIGENTEC All-Nitride (AN) technology enables our customers to develop their products in the Industrial Revolution 4.0.
You are about to enter this unique opportunity to bring R&D to product.
To support our continued growth, we are looking for a:
Customer Tape Out Engineer - Integrated Photonics
Tasks- Client Design Interface: Engage directly with client design teams to thoroughly understand their chip designs, advising on design for manufacturability (DFM) to ensure optimal compatibility with our fabrication processes.
- Design Verification and Optimization: Perform comprehensive checks on client photonic integrated circuit (PIC) layouts, ensuring conformity with our foundry's design rules and manufacturability criteria, and suggest necessary optimizations.
- Data Preparation for Manufacturing: Accurately prepare and validate client design data for the mask-making process, ensuring all elements are correctly formatted and aligned with our foundry's capabilities.
- Comprehensive Design Rule Checking (DRC): Execute thorough DRC processes to identify and resolve layout violations, collaborating with clients to ensure designs are optimised for our manufacturing environment.
- Layout vs. Schematic (LVS) Accuracy: Ensure the physical layout precisely matches the client's schematic designs, making adjustments as needed to meet our stringent standards.
- Executing the Final Tape-Out Process: Lead the final tape-out process, meticulously preparing and validating all design files, ensuring they are production-ready, and submitting them for manufacturing within the agreed timelines.
- Process Enhancement: Actively contribute to the enhancement of DFM guidelines, tape-out procedures, and client interaction protocols to continuously improve efficiency, manufacturability, and client satisfaction.
- Bachelor’s or Master’s degree in Electrical Engineering, Physics, Materials Science, or a related technical field
- Experience in the semiconductor industry, particularly in tape-out roles within a foundry environment, demonstrating a deep understanding of the tape-out process and its criticality in chip manufacturing
- Proficiency with EDA tools used in mask data preparation, preference on Mentor, Synopsys
- Experience with scripting languages (e.g., Python) for automation and process efficiency
- Knowledge of semiconductor manufacturing processes, especially photolithography
- Excellent communication and interpersonal abilities, capable of effectively collaborating with both clients and internal teams.
- Attention to detail and commitment to achieving high-quality outcomes.
- Excellent problem-solving skills, with the ability to identify, analyse, and resolve complex technical issues.
- Photonics experience is a strong plus
- Ability to work in a team and independently.
- A flexible and dynamic start-up work environment
- A highly international, diverse and highly motivated team
- Personal responsibility in your job and the chance to grow with us
- Our passion to bring PICs to everyday life.
We look forward to receiving your full application including 1) your CV, 2) a statement of interest (relating the position to your skills) and 3) grade or work certificates. Non-complete applications may not be considered.
LIGENTEC is a fast-growing European company with headquarter in Lausanne, Switzerland. Since 2021 we expanded our manufacturing capabilities by creating LIGENTEC France, in the South of Paris. We specialize in the design & manufacturing of Photonic Integrated Circuits (PICs) for customers in high-tech areas such as Quantum Technologies, LiDAR, Space Technologies, and Biosensors.
LIGENTEC All-Nitride (AN) technology enables our customers to develop their products in the Industrial Revolution 4.0.
