Backend Packaging Engineer for WLCSP
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STMicroelectronics invites motivated graduates to join as part of a Backend/Process-NPI oriented role in Grenoble. You will work closely with OSAT partners in Taiwan, learn the wafer-level packaging flow, and get hands-on exposure to the NPI procedures in STMicroelectronics’ Backend assembly sites.
Ideal candidates hold a Licence or Master in chemistry, physics, or engineering, exhibit strong teamwork and initiative, and demonstrate solid English communication skills.