Backend Packaging Engineer for WLCSP

Il y a 1 jour

Grenoble, Auvergne-Rhône-Alpes, France STMicroelectronics Temps plein 10 000 € - 15 000 € Contrat

STMicroelectronics invites motivated graduates to join as part of a Backend/Process-NPI oriented role in Grenoble. You will work closely with OSAT partners in Taiwan, learn the wafer-level packaging flow, and get hands-on exposure to the NPI procedures in STMicroelectronics’ Backend assembly sites.

Ideal candidates hold a Licence or Master in chemistry, physics, or engineering, exhibit strong teamwork and initiative, and demonstrate solid English communication skills.