Packaging Design Engineer – Imaging Tech, Hybrid/Remote
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Teledyne e2v Semiconductors SAS, based near Grenoble, FR, is hiring a Package Design Engineer to lead the complete design flow of advanced microelectronic packages. The role involves translating customer needs into technical specs, coordinating with packaging vendors, and overseeing R&D and improvement initiatives.
You will work across locations (Grenoble and Seville) with a focus on high-reliability imaging packages, interfacing with project teams, and ensuring robust design reviews from
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