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Senior IC Packaging Specialist

Il y a 2 mois


Grenoble, Auvergne-Rhône-Alpes, France IC Resources Temps plein
Job Description

IC Resources is seeking an experienced IC Packaging Technical Lead to drive all package-related activities, including materials development with sub-contract partners.

The successful candidate will participate in design reviews to design BGA packages and perform feasibility studies for substrate technology and electrical performance.

Key responsibilities will include:

  • Collaborating with assembly centre R&D teams to ensure continuous design performance improvement
  • Developing and implementing package assembly development strategies
  • Coordinating with sub-contract partners to develop and qualify new materials
  • Providing technical expertise to support the development of new IC packaging technologies

Required skills and qualifications include:

  • Strong experience in IC package assembly development
  • Expertise in BGA and flip chip technology
  • Qualification in semiconductor packaging
  • Excellent communication and interpersonal skills
  • Degree qualified in Electrical Engineering, Physics, or a related field

IC Resources is a leading provider of technical talent to the electronics industry. We offer a dynamic and challenging work environment, with opportunities for professional growth and development.