IC Packaging Technical Lead
il y a 4 semaines
IC Packaging Technical Lead Job Description
We are seeking an experienced IC Packaging Technical Lead to drive all package related activities, including materials development with sub-con partners. This role will involve participating in design reviews to design BGA packages and performing feasibility studies for substrate technology and electrical performance.
Key Responsibilities:
- Develop and implement package assembly development strategies
- Collaborate with assembly centre R&D teams for continuous design performance improvement
- Lead the development of BGA packages and substrate technology
- Perform feasibility studies for electrical performance
Requirements:
- Strong IC package assembly development experience
- BGA and flip chip knowledge
- Semiconductor packaging qualification experience
- Excellent communication skills, French language preferred
- Degree qualified in Electrical Engineering, Physics or similar
Please contact Rachel Anderson for further details.
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