Photonics Packaging Engineer

il y a 17 heures


Grenoble, Auvergne-Rhône-Alpes, France SCINTIL Photonics Temps plein
About Us

SCINTIL Photonics is a pioneering company at the forefront of semiconductor photonic technology. Our innovative solutions address the need for high-speed, dense, and energy-efficient optical connectivity for sustainable high-performance computing (AI/ML) and data center infrastructure.

Position Overview

We are expanding our product development team and seeking a skilled Packaging Engineer to join our dynamic and collaborative environment. As a key member of our team, you will be responsible for designing 3D packages for our Photonic Integrated Circuits (PICs), which interface with optical fibers and electronic circuits.

Key Responsibilities
  • Design and develop 3D packages for PICs, ensuring optimal performance and reliability.
  • Liaise with assembly partners and designers of photonic and electronic circuits to ensure seamless integration.
  • Utilize SolidWorks expertise to create sub-assemblies and 3D drawings.
  • Document changes to packages and maintain accurate records.
  • Collaborate with cross-functional teams to ensure quality and reliability of the design from prototyping to production.
Requirements
  • Strong background in semiconductor circuit packaging and/or micro-optics/fiber optics assembly technologies and processes.
  • Excellent communication and synthesis skills, with the ability to work in an international environment.
  • Proficiency in SolidWorks and ability to work with 3D design software.
  • Minimum 3 years of experience in a similar position.
Why Join Us

At SCINTIL Photonics, you will have the opportunity to work on cutting-edge technology, collaborate with a talented team, and contribute to the development of innovative solutions. We offer a competitive salary and benefits package, as well as opportunities for professional growth and development.


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