Senior IC Packaging Engineer

il y a 3 semaines


Grenoble, Auvergne-Rhône-Alpes, France IC Resources Temps plein
Position Overview

IC Resources is seeking an experienced IC Packaging Technical Lead to oversee all aspects of packaging initiatives, including the development of materials in collaboration with subcontracting partners.

This role will require active participation in design evaluations to create BGA packages and conduct feasibility assessments related to substrate technologies and electrical performance. Collaborating with R&D teams at assembly centers to enhance design efficiency will be a crucial component of this position.

Key Responsibilities
  • Lead the development of IC package assembly processes
  • Possess in-depth knowledge of BGA and flip chip technologies
  • Ensure compliance with semiconductor packaging qualification standards
  • Demonstrate exceptional communication abilities, with proficiency in French being advantageous
  • Hold a degree in Electrical Engineering, Physics, or a related field

For more information about this opportunity, please reach out to our recruitment team.


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