Board Level Multi-Physical System Engineer

il y a 6 jours


Grenoble, Auvergne-Rhône-Alpes, France Adoc Talent Management Temps plein

Job Overview

Adoc Talent Management is seeking a highly skilled Board Level Multi-Physical System Engineer to join a leading global ICT company specializing in Cloud and AI, telecommunications, and consumer businesses.

Key Responsibilities

  • Develop next-generation hardware solutions at the board level, including multi-physics modeling and simulation for complex module reliability.
  • Provide technical insights on next technology trends and implement them in the company's hardware products.
  • Collaborate with the local and Chinese team to solve technical challenges and participate in preparing specification and design documents.

Requirements

You hold a Master's degree or higher, or a PhD in Electronics, microelectronics, or equivalent. You have a deep understanding of microelectronics packaging, module substrate process, and module process, and be able to independently complete multi-physical field and multi-scale simulation and modeling of complex module packaging.

You have multi-scale and multi-physical field simulation modeling capabilities in electricity, magnetism, heat transfer, and mechanical. You are able to understand packaging challenges for reliability such as warpage and stress management, thermo-migration, electro-migration, and heat dissipation.

You have good knowledge in material properties of the constitutive layer such as PCB, TIM, substrate, underfill, and their implication on the overall integration. You have a good experience with industrial simulation software such as COMSOL or HFSS and so on. An experience in Python coding is a plus.

You are passionate about technology, driven by curiosity, and motivated to make substantial contributions in your area of expertise. You are fluent in English with excellent intercultural social and communication skills, and you excel in working within international teams.



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