Mechanical Engineer – RF Packaging for EW Systems

Il y a 3 jours

Paris, Île-de-France Harmattan AI Temps plein 65 000 € - 90 000 € Contrat

Harmattan AI in Paris is seeking a Mechanical Engineer for the Electronic Warfare team to design mechanical structures and packaging that house RF and EW/SIGINT electronics from concept through field deployment.

You will translate RF and electronic constraints into robust mechanical designs, collaborate with hardware, software, GNC and ML teams, and contribute to design reviews, documentation and traceability.