Senior IC Packaging Engineer — AI/Photonics, High-Impact Role

Il y a 2 jours

Paris, Nouvelle-Aquitaine, France Arago Temps plein 90 000 € - 130 000 € Contrat

Arago is seeking a Senior Packaging Engineer to lead IC packaging initiatives from concept to manufacturing, coordinating supply chain and sub-contractors for current and future devices.

You will guide cross-functional teams including IC design, optical, and PCB to ensure packaging specifications align across domains, drive high yield and process optimization, and perform comprehensive failure analysis to uphold quality and performance.