Senior Packaging Engineer
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Arago Inc. in Paris is seeking a Senior Packaging Engineer to lead IC packaging initiatives, managing processes from design to manufacturing. You will collaborate with cross-functional teams and ensure successful chip industrialization.
The ideal candidate has a Master’s degree in Electrical Engineering and over 5 years of experience in the semiconductor packaging industry. The role involves both technical expertise and project management.
Competitive benefits include healthcare, stock options, and relocation support.
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