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IC Packaging Technical Lead
Il y a 2 mois
IC Resources is seeking an experienced IC Packaging Technical Lead to drive all package-related activities, including materials development with sub-contract partners.
The successful candidate will participate in design reviews to design BGA packages and perform feasibility studies for substrate technology and electrical performance.
Key responsibilities will include:
- Collaborating with assembly centre R&D teams for continuous design performance improvement
- Developing and implementing package assembly development strategies
- Coordinating with sub-contract partners to ensure timely and cost-effective materials development
- Providing technical expertise to support the development of new package technologies
Required skills and qualifications include:
- Strong experience in IC package assembly development
- Expertise in BGA and flip chip technology
- Qualification in semiconductor packaging
- Excellent communication and interpersonal skills
- Degree qualified in Electrical Engineering, Physics, or a related field
IC Resources is a leading provider of technical talent to the electronics industry. We offer a dynamic and challenging work environment, with opportunities for professional growth and development.
