Analog / RF / mmWave IC Engineer (H/F)
Il y a 4 jours
Grenoble, Auvergne-Rhône-Alpes, France
TiHive
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About TiHive
TiHive develops advanced terahertz imaging and sensing systems for real-time industrial quality control. Our technology combines THz sources, cameras, CMOS/BiCMOS ICs, RF and mmWave electronics, optics, embedded systems, software, and AI to help manufacturers see through materials, inspect 100% of their production, and make better process decisions.
We are scaling our technology from advanced prototypes and pilots to robust industrial products deployed on production lines worldwide.
Role Overview
We are looking for an Analog / RF / mmWave IC Engineer to contribute to the design, development, characterization, validation, and integration of TiHive’s next-generation terahertz sources, detectors, cameras, and sensing platforms.
You will work on high-frequency integrated circuits used for power generation, signal detection, imaging, and sensing. The role covers the full IC development cycle, from architecture and circuit design to simulation, layout support, tape-out, lab characterization, and system integration.
A key part of the role will also be to help bring our ICs into real-life systems. This means contributing to the electronic design required to integrate, bias, control, test, and validate our ICs within complete camera and source platforms.
Experience in electronic board design is therefore important, especially for RF/mmWave IC integration, test boards, biasing electronics, control electronics, acquisition interfaces, and system-level validation.
Key Responsibilities
• Design analog, RF, mmWave, and high-frequency IC blocks for THz imaging and sensing systems.
• Contribute to complex power generation and detection circuits used in TiHive’s sources and cameras.
• Work on circuit blocks such as oscillators, multipliers, amplifiers, detectors, mixers, rectifiers, biasing circuits, and analog front ends.
• Design and optimize transmission lines, matching networks, passive structures, and high-frequency interconnects.
• Contribute to antenna design, antenna-circuit co-design, and electromagnetic optimization.
• Perform schematic design, simulation, post-layout analysis, and design validation.
• Support layout implementation for sensitive analog/RF/mmWave circuits.
• Participate in tape-out preparation, verification, and design documentation.
• Define and execute IC characterization and validation plans.
• Test and debug new silicon using RF, mmWave, and THz lab equipment.
• Contribute to electronic board design for IC integration, test, biasing, control, and validation.
• Design or support the design of test boards, bias boards, control boards, and integration boards.
• Help make TiHive’s ICs work reliably in complete camera and source systems.
• Support the integration of ICs into TiHive’s electronics, embedded platforms, acquisition systems, and industrial products.
• Collaborate with electronics, embedded, software, optics, mechanical, and system engineering teams. Required Profile
• At least 5 years of professional experience in analog, RF, mmWave, or high-frequency IC design.
• Strong experience in analog and RF integrated circuit design.
• Solid knowledge of mmWave design principles and high-frequency silicon constraints.
• Experience designing circuits for power generation, signal detection, sensing, imaging, or communication systems.
• Good understanding of antennas, transmission lines, impedance matching, parasitics, grounding, isolation, and layout-sensitive design.
• Experience with RF/mmWave simulation, EM simulation, post-layout extraction, and silicon validation.
• Hands-on experience with lab characterization, measurement setups, and hardware debugging.
• Experience with electronic board design, especially for IC integration, test boards, biasing, control, and validation.
• Ability to move from circuit architecture to practical implementation and system integration.
• Strong analytical mindset, technical rigor, and good documentation practices. Strong Added Value
• Experience with CMOS, BiCMOS, SiGe, or advanced silicon technologies.
• Experience in THz, mmWave, radar, imaging, sensing, or high-frequency communication systems.
• Experience with on-chip antennas, antenna arrays, or antenna-circuit co-design.
• Experience with high-frequency packaging, chip-to-board transitions, probes, waveguides, or RF/THz test setups.
• Experience with embedded electronics, board-level electronics, or hardware system integration.
• Experience designing test boards, bias boards, control electronics, acquisition interfaces, or RF/mmWave integration boards.
• Experience with PCB design constraints such as power integrity, signal integrity, grounding, shielding, filtering, noise reduction, and EMC.
• Experience taking ICs from design to tape-out, characterization, board integration, and product integration. Tools & Technical Environment
• Cadence Virtuoso, SpectreRF, ADE, Calibre, Assura, or similar IC design environments.
• HFSS, CST, Momentum, EMX, Sonnet, or similar EM simulation tools.
• ADS, AWR, MATLAB, Python, or similar tools.
• Altium, KiCad, Cadence Allegro, OrCAD, or similar PCB design tools.
• Spectrum analyzers, VNAs, signal generators, oscilloscopes, probe stations, power meters, and THz measurement benches. Soft Skills
• Hands-on, rigorous, and technically curious.
• Comfortable working on complex deep-tech hardware systems.
• Able to think from transistor-level design to system-level performance.
• Able to bridge IC design, board-level electronics, and real-life product integration.
• Autonomous, structured, and solution-oriented.
• Comfortable working in a multidisciplinary scale-up environment.
• Able to balance performance, reliability, manufacturability, and product constraints. Why Join TiHive? At TiHive, you will work on a unique technology platform combining silicon IC design, mmWave/THz hardware, imaging systems, industrial electronics, and AI-based process intelligence. You will contribute directly to the core technology behind our cameras and sources, from integrated circuit design to electronic integration and real-world industrial deployment. Our Mission To make quality accessible for everyone, everywhere, by giving industries the power to see through materials, control 100% of their products in real time, and turn invisible data into better decisions.
Key Responsibilities
• Design analog, RF, mmWave, and high-frequency IC blocks for THz imaging and sensing systems.
• Contribute to complex power generation and detection circuits used in TiHive’s sources and cameras.
• Work on circuit blocks such as oscillators, multipliers, amplifiers, detectors, mixers, rectifiers, biasing circuits, and analog front ends.
• Design and optimize transmission lines, matching networks, passive structures, and high-frequency interconnects.
• Contribute to antenna design, antenna-circuit co-design, and electromagnetic optimization.
• Perform schematic design, simulation, post-layout analysis, and design validation.
• Support layout implementation for sensitive analog/RF/mmWave circuits.
• Participate in tape-out preparation, verification, and design documentation.
• Define and execute IC characterization and validation plans.
• Test and debug new silicon using RF, mmWave, and THz lab equipment.
• Contribute to electronic board design for IC integration, test, biasing, control, and validation.
• Design or support the design of test boards, bias boards, control boards, and integration boards.
• Help make TiHive’s ICs work reliably in complete camera and source systems.
• Support the integration of ICs into TiHive’s electronics, embedded platforms, acquisition systems, and industrial products.
• Collaborate with electronics, embedded, software, optics, mechanical, and system engineering teams. Required Profile
• At least 5 years of professional experience in analog, RF, mmWave, or high-frequency IC design.
• Strong experience in analog and RF integrated circuit design.
• Solid knowledge of mmWave design principles and high-frequency silicon constraints.
• Experience designing circuits for power generation, signal detection, sensing, imaging, or communication systems.
• Good understanding of antennas, transmission lines, impedance matching, parasitics, grounding, isolation, and layout-sensitive design.
• Experience with RF/mmWave simulation, EM simulation, post-layout extraction, and silicon validation.
• Hands-on experience with lab characterization, measurement setups, and hardware debugging.
• Experience with electronic board design, especially for IC integration, test boards, biasing, control, and validation.
• Ability to move from circuit architecture to practical implementation and system integration.
• Strong analytical mindset, technical rigor, and good documentation practices. Strong Added Value
• Experience with CMOS, BiCMOS, SiGe, or advanced silicon technologies.
• Experience in THz, mmWave, radar, imaging, sensing, or high-frequency communication systems.
• Experience with on-chip antennas, antenna arrays, or antenna-circuit co-design.
• Experience with high-frequency packaging, chip-to-board transitions, probes, waveguides, or RF/THz test setups.
• Experience with embedded electronics, board-level electronics, or hardware system integration.
• Experience designing test boards, bias boards, control electronics, acquisition interfaces, or RF/mmWave integration boards.
• Experience with PCB design constraints such as power integrity, signal integrity, grounding, shielding, filtering, noise reduction, and EMC.
• Experience taking ICs from design to tape-out, characterization, board integration, and product integration. Tools & Technical Environment
• Cadence Virtuoso, SpectreRF, ADE, Calibre, Assura, or similar IC design environments.
• HFSS, CST, Momentum, EMX, Sonnet, or similar EM simulation tools.
• ADS, AWR, MATLAB, Python, or similar tools.
• Altium, KiCad, Cadence Allegro, OrCAD, or similar PCB design tools.
• Spectrum analyzers, VNAs, signal generators, oscilloscopes, probe stations, power meters, and THz measurement benches. Soft Skills
• Hands-on, rigorous, and technically curious.
• Comfortable working on complex deep-tech hardware systems.
• Able to think from transistor-level design to system-level performance.
• Able to bridge IC design, board-level electronics, and real-life product integration.
• Autonomous, structured, and solution-oriented.
• Comfortable working in a multidisciplinary scale-up environment.
• Able to balance performance, reliability, manufacturability, and product constraints. Why Join TiHive? At TiHive, you will work on a unique technology platform combining silicon IC design, mmWave/THz hardware, imaging systems, industrial electronics, and AI-based process intelligence. You will contribute directly to the core technology behind our cameras and sources, from integrated circuit design to electronic integration and real-world industrial deployment. Our Mission To make quality accessible for everyone, everywhere, by giving industries the power to see through materials, control 100% of their products in real time, and turn invisible data into better decisions.