Senior Advanced Packaging Integration Engineer

Open role Senior Advanced Packaging Integration Engineer Our mission AI is becoming fundamental to how the world works. When it is, the ability to compute, and to manufacture the hardware that computes, should not be concentrated in a few places. Touchdown's mission is to make compute accessible to the whole world and to reindustrialize advanced semiconductor manufacturing in the United States. We co-design everything for next-generation compute: the AI systems people use, the software that serves them, the architectures and chips underneath, and the packaging, test, and manufacturing that make them real. Co-design brings down the complexity and cost of building compute. That is what makes manufacturing in America competitive again, and what puts compute within reach of people and companies everywhere. We build alongside the world's best manufacturing ecosystems, including Taiwan's, and every role here makes one layer better and carries what it learns to the rest. Why this role matters Packaging is where chips become systems, and it now sets much of a system's bandwidth, power, and thermal limits. Co-designing compute means designing the package with the silicon, not after it. Technical scope 2.5D and 3D integration, fan-out, and flip-chip flows; interposers and redistribution layers; die-to-die interconnect; warpage and thermomechanical stress; underfill and molding; known-good-die strategy; package-level test and reliability; design-for-assembly reviews with chip and system teams. First 90 days
• Take ownership of packaging integration on active programs.
• Name assembly, warpage, and test risks and the plan to close them.
• Hand off qualification plans with test and reliability. What you will own
• Package integration and design-for-assembly reviews.
• Process windows across assembly steps.
• Coordination with packaging partners. What you bring
• 8+ years in a high-volume fab, foundry, or advanced-packaging environment.
• Advanced packaging integration (2.5D/3D, fan-out, or flip chip).
• Package reliability fundamentals.
• Has taken a 2.5D, 3D, fan-out, or high-density flip-chip package from development into qualification.
• Understands warpage, underfill, and thermomechanical failure modes. Helpful experience
• Mandarin How we work
• AI-native by default. You use coding agents, AI-assisted analysis, and automation every day, and you check their output against measurements before anyone relies on it.
• We work alongside foundries, test houses, OSATs, and research labs, and we build with partners rather than against them.
• Touchdown does not operate a production fab today.
• Do not bring, send, or use confidential information or trade secrets from a current or former employer. We hire for skill and judgment, not for anyone else's process recipes. How the role works
• Full-time.
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Location:
Hsinchu, Taiwan.
• Openings: Multiple.
• Taiwan roles are employed through a local employer of record. Mandarin is a strong plus for Taiwan roles; English is required for written work.
• Start date and employment details are discussed during the process. Apply for this role → Applications are reviewed against the work described here. We do not use a degree, title, or keyword list as a substitute for evidence.