Senior Electronics Engineer High-Volume Production

Embedded & Safety-Critical Boards – Low-Cost, High-Volume Industrialization

📍 Location: Paris Region (on-site)
🛰️ Sector: Next-gen European Defense
💼 Type: Full-time, Permanent
📈 Seniority: Senior (5y+)
💰 Compensation: Competitive Salary + Equity + Full Health Coverage

About EGIDE

EGIDE is building a new European defense leader focused on scalable, intelligent air-defense architectures. We develop mass-use interceptors designed to neutralize low-cost, high-volume threats such as Shahed-type loitering munitions and FPV drones.
Our systems combine missile-grade lethality with modern software-defined architectures and electrically propelled interceptors, enabling a new class of cost-effective and rapidly deployable
air defense solutions.

We are assembling a world-class engineering team to design, test, and industrialize these systems at pace.

About the Role

Countering mass threats requires mass-produced effectors. As an Electronics Engineer, you will lead, directly or through design subcontractors under your technical authority, the design and industrialization of the electronic boards of our weapon systems, from embedded computing and power electronics to safety-critical functions.

Your core mission is to make these boards manufacturable at large scale and low cost without compromising safety: design-to-cost from the first schematic, design for automated manufacturing and test, supply chain robustness, and a production ramp-up driven by yield, quality and unit cost.

You will cover the full lifecycle, from architecture and specification through to the definition ofmanufacturing methods and processes, production follow-up and board acceptance. You will workclosely with the Munition Safety Engineer, the embedded software team and our manufacturing partners.

What You’ll Do

• Design and lead the design of a standardized family of embedded boards (processing, power, interfaces, safety functions) with a design-to-cost approach: BOM cost targets, part count reduction, reuse of common building blocks across products.

• Select components for cost, availability and volume: COTS, industrial and automotive-grade parts (AEC-Q100 / Q200), multi-sourcing and European or ITAR-free supply options, lifecycle and obsolescence risk· Implement safety logic by design on safety-critical boards and contribute to dependability analyses (FMECA, FTA, reliability, SPF) with the Munition Safety Engineer

• Drive design for high-volume manufacturing:

  • DFM / DFA: full SMT, reflow-compatible assemblies, panelization, minimal manual operations, selective coating

  • DFT: test coverage strategy, boundary scan (JTAG), in-line programming, AOI / X-ray, ICT or flying probe, automated functional testing

  • Traceability: serialization, production data collection, configuration management

• Define manufacturing methods and processes: process specifications, control plans, PFMEA, production test benches, ESS / burn-in strategy sized for volume, manufacturing and inspection files

• Select and manage EMS partners: RFQs and cost breakdowns, capacity assessment, second sourcing, NRE and tooling, transfer to production

• Lead the ramp-up from prototypes to pre-series and series: First Article Inspection (FAI), production acceptance, yield (FPY) and SPC monitoring, non-conformance handling and root cause analysis (8D)

• Run continuous cost-down and value engineering on released boards, including qualification by similarity for component changes

• Plan and execute validation and qualification (functional, EMC / E3, environmental) in line with applicable standards (MIL-STD-461 / 464, MIL-STD-810, IPC Class 3 or equivalents); participate in design reviews (PDR, CDR, PRR)

• Produce and maintain the board definition package: specifications, design documentation, ICDs, test and acceptance procedures (ATP)

You Are a Fit If You Have

• Engineering degree (electronics, electrical engineering, embedded systems or equivalent)

• 5+ years of experience in electronic board design and industrialization, including at least one product brought to high-volume production (automotive, industrial, consumer, telecom or defense)

• Proven design-to-cost track record: BOM optimization, component standardization, cost-down programs

• Strong DFM / DFA / DFT practice and knowledge of SMT assembly processes and IPC stand