Senior Packaging Engineer

Il y a 17 heures

Paris, Nouvelle-Aquitaine, France Arago Inc. Temps plein 60 000 € - 85 000 € Contrat

Arago Inc. in Paris is seeking a Senior Packaging Engineer to lead IC packaging initiatives, managing processes from design to manufacturing. You will collaborate with cross-functional teams and ensure successful chip industrialization.

The ideal candidate has a Master’s degree in Electrical Engineering and over 5 years of experience in the semiconductor packaging industry. The role involves both technical expertise and project management.

Competitive benefits include healthcare, stock options, and relocation support.